The SEMI Fab Owners Alliance (FOA) Q1 Summit in Austin, Texas brought together leaders from across the semiconductor ecosystem (and around the globe!) to examine the forces shaping the next phase of industry growth.
If you are unfamiliar with this members-only forum, the FOA Summit provides a unique opportunity for semiconductor manufacturers, technology providers, and industry analysts to exchange insights, analyze industry data, and collaborate on strategies for navigating an increasingly complex global landscape. SEMI plays a vital role in fostering this community while producing research that helps unify the sector around shared priorities: strengthening supply chain resilience, navigating geopolitical pressures, accelerating innovation, and supporting sustainable growth across the semiconductor value chain.
Our team had the opportunity to attend the summit, connect with industry leaders, and present our own case study with our customer and partner, Analog Devices. The session explored how semiconductor manufacturers are addressing workforce challenges through structured knowledge capture, improved onboarding experiences, and automated, audit-ready training programs that help increase productivity and operational consistency across fabs.
Across presentations and discussions, several themes emerged that point to a semiconductor industry undergoing significant transformation:
Key Takeaways from the FOA Q1 Summit
- AI investment is concentrating capital toward leading-edge logic and high-bandwidth memory (HBM), reshaping semiconductor demand patterns.
- Capacity expansion is being driven by three major forces: AI and high-performance computing growth, disciplined memory investment cycles, and China’s continued mature-node expansion.
- Equipment investment is increasingly focused on AI-critical segments, including leading-edge wafer fabrication and advanced packaging, with peak investment expected between 2026 and 2028.
- Materials and wafer markets are beginning to recover, though the AI boom has not yet translated into broad-based demand growth across all materials segments.
Together, these dynamics highlight how artificial intelligence is becoming the defining force shaping semiconductor investment, infrastructure, and workforce planning over the next decade.
The AI Boom and Its Impact on the Semiconductor Industry
No surprises here: Artificial intelligence has quickly become the primary driver of semiconductor demand.
At the FOA Summit, analysts emphasized that AI usage is scaling faster than infrastructure capacity can expand, creating unprecedented pressure on semiconductor manufacturing. For example, large language models (LLMs) are already generating extraordinary computation demand. ByteDance’s Doubao model alone processes an average of 50 trillion tokens per day — more than 1,500 trillion tokens each month.
As AI adoption spreads across industries, this demand is translating directly into increased semiconductor investment.
According to Morgan Stanley and SEMI estimates (Q1 2026):
- AI-driven cloud infrastructure spending is expected to grow at a 31% CAGR from 2024 to 2028
- The AI semiconductor market could exceed $1 trillion by 2027
- Global semiconductor revenue tied to AI workloads is projected to grow significantly faster than non-AI segments through 2030
This rapid expansion is reshaping manufacturing priorities across the semiconductor ecosystem. Leading-edge logic nodes, advanced packaging technologies, and high-bandwidth memory are now receiving the majority of new investment because they are essential for training and deploying AI models at scale.
At the same time, other semiconductor segments are becoming increasingly influenced by policy and regional investment strategies. Government incentives and national technology initiatives are playing a growing role in determining where new fabrication capacity is built and how quickly it comes online.
Semiconductor Capacity Is Being Remapped
The rise of AI infrastructure is reshaping global semiconductor manufacturing capacity. Industry analysts highlighted three key forces driving this shift.
AI and High-Performance Computing Growth
AI workloads require significantly more advanced semiconductor architectures than traditional computing applications.
This has accelerated demand for:
- Leading-edge wafer fabrication
AI accelerators and GPUs
High-bandwidth memory
Advanced packaging technologies
As a result, much of the new capacity being added globally is designed specifically to support AI infrastructure rather than traditional compute markets.

Memory Market Discipline
Memory manufacturers are also playing a major role in shaping the industry’s investment cycle. After years of volatile boom-and-bust cycles, leading memory producers are maintaining a more disciplined approach to capacity expansion. However, the explosive growth of AI workloads has created a new wave of investment focused on HBM production, which is essential for supporting high-performance AI systems. This dynamic is expected to significantly influence semiconductor supply cycles over the next several years.
China’s Mature-Node Expansion
At the same time, China continues to expand mature-node manufacturing capacity as part of broader national semiconductor strategies.
This expansion is contributing to a more complex global capacity landscape in which:
- Leading-edge AI manufacturing expands in some regions
- Mature-node capacity continues to grow elsewhere
- Policy incentives increasingly influence where fabs are built
The result is a semiconductor industry where capacity growth is becoming more technologically and geographically segmented than in previous cycles.
Semiconductor Equipment Investment Is Accelerating
Another major theme from the FOA summit was the scale of investment flowing into semiconductor manufacturing equipment.

According to industry forecasts shared during the event:
- Total semiconductor equipment spending is expected to reach $133 billion in 2025
- The market could surpass $156 billion by 2027 Fab investment is also expected to surge significantly over the coming decade, with annual spending projected to approach $50 billion by 2029–2030.
Much of this capital is being directed toward the areas most critical for AI infrastructure, including:
- Leading-edge wafer fabrication equipment
- Advanced packaging technologies
- Semiconductor testing and verification systems
Analysts also noted that the peak equipment cycle is expected between 2026 and 2028, with regional winners shaped heavily by government incentives, localization strategies, and geopolitical considerations.
Materials and Wafer Markets Are Recovering
While AI demand is influencing semiconductor investment, the impact on materials and wafer markets has been more uneven.
According to insights shared at the FOA summit:
- Silicon wafer demand is beginning to recover as fab utilization increases
- Materials intensity is rising in advanced manufacturing processes
However, the AI boom has not yet translated into fully broad-based materials demand growth across the entire semiconductor supply chain. Instead, much of the increase is concentrated in advanced manufacturing steps where AI chips require significantly more complex processing. This highlights an important distinction between volume growth and process intensity — both of which will shape the semiconductor industry’s next investment cycle.
The Semiconductor Workforce Challenge
Beyond infrastructure and capital investment, one of the most pressing challenges discussed at the FOA summit was the future semiconductor workforce.
As fabs expand and AI infrastructure accelerates demand for chips, the industry faces a growing talent gap — this is a topic we’ve been following closely at Seertech. According to SEMI workforce projections, the U.S. semiconductor industry will require approximately 170,000 new workers within the next five years to support manufacturing expansion and technology innovation.
Additional research reinforces the scale of the challenge:
A Deloitte and Semiconductor Industry Association report estimates that more than half of these roles may remain unfilled by 2030 if workforce pipelines are not expanded, highlighting the urgency of talent development efforts across the sector.
Meanwhile, McKinsey research suggests that advanced manufacturing industries — including semiconductor fabrication — are facing a growing gap between the skills required for modern production environments and the training infrastructure currently available to support them.
These roles span a wide range of disciplines, including:
- Semiconductor manufacturing technicians
- Process engineers
- Equipment specialists
- Supply chain professionals
- Advanced manufacturing operators
For semiconductor manufacturers, the challenge extends beyond simply hiring more workers. Modern fabs rely on highly specialized operational knowledge built over decades of engineering experience. As seasoned engineers retire and new employees enter the workforce, companies must ensure that this expertise is captured, transferred, and validated in ways that maintain operational excellence.
This theme surfaced repeatedly throughout conversations at the FOA Summit. During Seertech’s joint presentation with Analog Devices, we explored how semiconductor manufacturers are addressing these challenges through structured knowledge capture and digital learning strategies designed to support faster onboarding and improved workforce productivity.
In highly regulated and precision-driven environments like semiconductor manufacturing, traditional training approaches can struggle to keep pace with evolving processes and complex equipment requirements. Organizations are increasingly exploring automated, audit-ready training environments that help standardize knowledge transfer, ensure compliance, and verify that employees have the validated skills required for their roles.
These strategies also help address another critical issue facing semiconductor companies: the loss of institutional knowledge. When experienced engineers and technicians retire or move on, their expertise often disappears with them, especially if processes and operational insights exist primarily as tribal knowledge.
Capturing this expertise in structured learning environments allows organizations to improve:
- New employee onboarding experiences
- Workforce productivity and time-to-proficiency
- Operational consistency across fabs
- Compliance and audit readiness
In the context of the AI-powered landscape we’re squarely in the throes of, workforce enablement is just as important as capital investment in determining which organizations can scale successfully.
Looking Ahead Q2, 2026, 2027 and Beyond: The Next Phase of Semiconductor Industry Growth
The discussions at the SEMI FOA Q1 Summit confirmed what most other industries are also facing: AI is reshaping demand patterns, investment cycles, and priorities across the entire business ecosystem.
At the same time, geopolitical dynamics, supply chain resilience initiatives, and workforce challenges are introducing new layers of complexity for semiconductor manufacturers. Organizations that succeed in this environment will be those that can adapt quickly, scale intelligently, and invest strategically in both technology and talent.
As the industry continues to evolve, forums like the SEMI Fab Owners Alliance will remain essential spaces for collaboration, insight sharing, and strategic alignment across the semiconductor ecosystem.
We look forward to continuing these conversations and supporting the innovations that will power the next generation of global technology.
Your fabs are scaling. Is your workforce strategy keeping up? Let’s talk!
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